ADS-E86
Recipe Controlled Automatic Evaporation System
Product Information
Overview
Features
- High pumping speed: From atmospheric pressure to E-3Pa within 3minutes (load lock chamber)
- One-click of the “START“button after recipe selection for fully automatic control from vacuum pumping to completing deposition.
- No limit to the number of processes and deposition layers for recipe control software
- Compact and space-saving with original wafer transport mechanism
- Easy Maintenance with a large front hatch installed in the deposition chamber.
- Stable deposition even at low rates (Au and Al 0.1 Å/sec)
- Substrate cooling system for lift-off process
- “Equipped with a 23-inch wide monitor for visibility and operability
| Chamber inside Dimensions | 600×600×800 mm ※Degassed in high vacuum |
| Vacuum Pumps | 2100 L/sec TMP+Dry pump |
| Substrate Stage | 10 mm rectangular ~ Ø 8 inch with water-cooling system (no substrate rotation) Equipped with pneumatic actuated substrate shutter |
| Film Thickness Monitor | QCM sensor（1ch） |
| Electron gun | 6.4 kW 270°deflection angle ※Emitter Assy replacement designed not to disconnect high voltage cable |
| Crucible | Capacity 12 ml×6 spot, Rotatable crucible ※Cross contamination prevention ※10-crucible option available |
| Hearth Liner | Multiple hearth liner options available |
PC Controlled Deposition Recipe
■Deposition monitor screen
Display and interlock (I/L)
・Deposition rate (Å/sec), Output (%), Accumulated film thickness (Å)
・Rate deviation, Rate deviation alarm, Rate over SP, Output over alarm SP
・Crystal life (%), Frequency (Hz), Crystal life I/L, Crystal life abort SP
■Recipe Operation Screen (Recipe Main Parameter Setup)
Parameter settings for each step
・Crucible/material selection, Accumulated film thickness (Å), Deposition rate (Å/sec)
・Pre-deposition condition setup
・Film thickness controller interface: 15 parameters can be set for each material.
■PLC control (Vacuum pumping, Substrate transfer, Crucible position)
OPERATION MODE Screen
・User’s screen: Fully automatic evaporation
・Fully automatic: START (ABORT)
・Load lock: Vacuum hold or VENT *Option of automatic or non-automatic up to VENT is available.
・Status display: Vacuum pumping diagram / Vacuum elapsed time / E-GUN / Data logging
